无铅锡球特性:
本产品的纯度和圆球度均十分高,适用于BGA、CSP等顶级封装技能及微细焊接运用,运用时具主动校对才能并可容许相对较大的置放差错,无端面平整度问题.
序号Serial number | 项目Item | 产品参数Product parameter | 测验办法Testing method |
1 | 外观Appearance | 银色,亮光球状实心固体Silvery,shining globosity solid | / |
2 | 气味Odor | 无气味No odor | / |
3 | 首要成份Main composition | Sn96.5Ag3.0Cu0.5 Sn95.5Ag3.8Cu0.7 Sn95.5Ag4.0Cu0.5 | 感应耦合电浆原子放射光谱分光仪器Plasma emission spectrometers |
4 | 比重Density | 7.42-7.44 | / |
5 | 溶点Melting point | 217-221℃ | DSC测验仪DSC tester |
6 | 含氧量Oxygen contain | 0.005%-0.01% | 精细氧化分析仪Precision oxygen analyzer |
7 | 包装Packaging | 250K/瓶500K/瓶1KK/瓶250K/JAR 500K/JAR 1KK/JAR | / |
8 | 尺度规格Ｄimension specification | 0.889mm±0.0008 | 印象量测体系仪Vision measuring machine |
0.76mm±0.020 |
0.65mm±0.018 |
0.60mm±0.018 |
0.****±0.015 |
0.50mm±0.015 |
0.45mm±0.012 |
0.40mm±0.012 |
0.35mm±0.010 |
0.30mm±0.010 |
0.25mm±0.008 |
0.20mm±0.008 |
0.15mm±0.005 |
0.10mm±0.005 |
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